Jiangsu Changjiang Electronics Technology (JCET), the largest semiconductor packaging and test services provider in China, has landed assembly orders for SiP (system-in-package) modules from Apple for 2016, reports DigiTimes.JCET will be a new contract provider of SiP assembly services for Apple, adding to the existing suppliers including Japan’s Murata and Universal Scientific Industrial (USI) of Taiwan-based Advanced Semiconductor Engineering (ASE), according to industry sources. STATS ChipPAC, which was acquired by JCET earlier in 2015, already has its Korea-based operation obtain certification from Apple, said the sources.Notably, JCET’s board has approved a plan to spend $200 million to expand production lines for SiP modules. Currently, Apple uses a SiP design for the Apple Watch and there have been rumors that the company is looking to do the same for the iPhone.Share Article:Facebook,   Twitter,   LinkedIn,   Google Plus,   Email,   Reddit,   Digg,   Delicious,   StumbleUponFollow iClarified:Facebook,   Twitter,   LinkedIn,   Google Plus,   Newsletter,   App Store,   YouTubeAdvertise Here

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