Leaked diagrams allegedly of the iPhone 6s logic board reveal a new SiP (System-in-Package) design. The images were spotted on Weibo by GforGames.According to the originator of the above schematics, it looks like Apple has indeed chosen to go the SiP route, with the A9 SoC integrating the power management and the baseband chip. Overall, it is being said that other chips as well are integrated into “packages”, with the motherboard’s components looking somewhat simplified.In addition, it’s said that the A9 chipset takes 15% less space than the A8 SoC and that the iPhone 6s will be offered in 16, 64, and 128GB versions.Share Article:Facebook,   Twitter,   LinkedIn,   Google Plus,   Email,   Reddit,   Digg,   Delicious,   StumbleUponFollow iClarified:Facebook,   Twitter,   LinkedIn,   Google Plus,   Newsletter,   App Store,   YouTubeAdvertise Here

Source: iClarified Read More: Alleged iPhone 6s Logic Board Diagram Reveals SiP Design [Images]